Thermal Conductive Insulating Silicone Gasket

4.5w/m-K Thermal Conductive Insulating Silicone Gasket

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4.0w/m-K Thermal Conductive Insulating Silicone Gasket

TP400 series thermal pad is naturally sticky silicone based insulation conductive material which is used to fill air gaps between heat generating components and heat sinks.

Due to its low hardness and great compressibility, TP400 thermal pad works as the perfect gap filler and bridges uneven surface and gaps without any problems.

It can replace Fujipoly GR45A / GR-m , Laird Tflex 700 , Bergquist GP3000 series.

TP400 series thermal pad main features:

Thermal conductivity: 4.0 W/m-K

Extremely soft and cost effective

Naturally tacky on both sides

Electrically insulating

TP400 series thermal pad typical applications:

LED lighting

Power conversion / supply

Thermal module

Electric vehicle battery

Semiconductor, IC, CPU.MOS and heatsink

Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader

**TP400 thermal pad properties**
Properties	Units	TP400	Test Method
Main Composition	---	Silicone & Ceramic filled	---
Color	---	Pink/Gray/Blue	Visual
Thickness Range	mm	0.3~10.0	---
Hardness	Shore 00	40-45	ASTM D2240
Density	g/cc	3.1	ASTM D792
Tensile Strength	KN/m	0.4	ASTM D412
Elongation	%	75%	ASTM D412
Continuous Use Temp	℃	-40 to 200	EN344
Breakdown Voltage	Kv/mm	≥6.0	ASTM D149
Volume Impedance	ohm-cm	1.0*10¹³	ASTM D257
Dielectric Constant	1MHz	5.5	ASTM D150
Thermal Impedance@0.5mm	℃in2/W	0.26	ASTM D5470
Flame Rating	---	V-0	UL 94
Thermal Conductivity	W/m.k	4.0	ASTM D5470
SGS, RoHS, REACH	---	Compliance	---

**Similar Material Comparison**
Brand	Baisontech	Fujipoly	Laird	Bergquist
Model	TP400	GR45A	Tflex 700	GP3000S30
Conductivity(W/m-k)	4.0	4.5	5	3.0
Thickness(mm)	0.3-10.0	0.5-3.0	0.5-5.0	0.25-3.2
Hardness(Shore 00)	40-45	50	50	30
Compliance	UL 94	UL 94	UL 94	UL 94

Configurations:

Standard size 200mm x 400mm ; 300mm x 300mm ; die cut parts available ; roll form avilable( length 50M)

Available with PSA on reinforced side.